Quality & Defects
First-pass yield, per-station scrap, Pareto and AI-driven root cause.
M01· YOLOv8-seg cell defect detectorM02· ViT-B/16 cell-grade classifierM25· ViT-S microcrack detectorM37· XGBoost defect-code propensityM10· SHAP root-cause explainer
First-Pass Yield
96.85%
Product of all station yields
Total scrap
0
107 defect events tracked
Rework
0
Cells routed back upstream
Cost of poor quality
$45
Scrap + rework, this run
Yield & OEE trendlast 60 samples
Quality alertsM08
No quality alerts in this window.
Per-station yield
live (≥10 units processed) · else baselineWafer Inspection
INSP
99.80%
11
Texturing
TEX
99.80%
6
Diffusion (POCl₃)
DIFF
99.70%
9
PECVD (SiNx)
PECVD
99.70%
8
Screen Printing
PRINT
99.60%
14
Firing Furnace
FIRE
99.80%
7
Cell Test & Sort
CELL
99.50%
15
Stringing
STR
99.70%
8
Lamination
LAM
99.60%
9
Framing & J-Box
FRAME
99.90%
7
Final Test (EL/Flash)
TEST
99.70%
13
Defect Pareto
M01M37baseline (no scrap yet)Predicted distribution from recipe weights · 107
PRINT
Finger interruptionM02
7
6.5%
DIFF
Sheet resistance OOSM02
6
5.6%
CELL
Low PmaxM02
6
5.6%
LAM
EVA bubbleM02
6
5.6%
TEST
Flash power lowM02
6
5.6%
INSP
Edge chipM02
5
4.7%
PECVD
SiNx thickness OOSM02
5
4.7%
CELL
EL dark areaM02
5
4.7%
STR
Cold solder jointM02
5
4.7%
TEST
EL dark spotM02
5
4.7%
INSP
Micro-crackM02
4
3.7%
TEX
Uneven textureM02
4
3.7%
PRINT
Paste smearM02
4
3.7%
FIRE
Poor adhesionM02
4
3.7%
CELL
Hot spot (EL)M02
4
3.7%
FRAME
J-box leakM02
4
3.7%
DIFF
Non-uniformityM02
3
2.8%
PECVD
PinholeM02
3
2.8%
PRINT
MisregistrationM02
3
2.8%
FIRE
Cell bowM02
3
2.8%
STR
Cell misalignmentM02
3
2.8%
LAM
DelaminationM02
3
2.8%
FRAME
Frame gapM02
3
2.8%
INSP
ContaminationM02
2
1.9%
TEX
Stain markM02
2
1.9%
TEST
HiPot failM02
2
1.9%